We already know about the upcoming model of Ascend family known as Huawei Ascend P8. According to the latest leak the giant of the company will come in a metal body and follow the same slim and sleek design pattern. The handset has 5.2 inches display with 1080 pixels resolution and has octa core processor paired with HiSilicon Kirin 930 system on chip which has the ability of TSMC’s 16 nm process built in.
Recently some new information leaked about the handset and gives the sight about the metal body of the smartphone. According to the latest revealed images it is going to be a metal body handset. The accurate measurement of smartphone is still not known. As seen in pictures, the camera shows one LED FLASH and has two trays that can be ejected; one for the primary SIM and second for the second SIM or it may be for the memory card. Although previously Huawei has placed sim card and memory card in one single tray with 2 slots. Maybe this is the case with Huawei Ascend P8 as well.
It is expected that Huawei Ascend P8 will be announce on CES in Las Vegas in January or MWC expo at Barcelona in March next year. Let us see what practically happens.