Qualcomm has announced the three new Chipsets for the mid-range smartphones at an event in New Delhi. The new chipsets are the Snapdragon 720G, the Snapdragon 662, and the Snapdragon 460. The new system-on-chip (SoC) models by the company are aimed to provide fast 4G connectivity alongside supporting Wi-Fi 6 and Bluetooth 5.1, and the Qualcomm Snapdragon 720G, Snapdragon 662, and Snapdragon 460 also come with the Qualcomm AI Engine and Qualcomm Sensing Hub. Mobile phones powered by the Qualcomm Snapdragon 720G are expected to debut in March 2020, while handsets based on the Snapdragon 662 and Snapdragon 460 are rumored to come by the end of this year. Qualcomm hasn’t revealed the list of original equipment manufacturers (OEMs) that will use the new chips. However, Oppo Mobile and Xiaomi Mobiles are set to be the two initial phone makers making smartphones with the Snapdragon 720G SoC.
Snapdragon 720G (SM7125)
The Snapdragon 720G is a successor to the Snapdragon 710 and SDM 712 SoCs. This new 8nm Chipset has eight cores arranged in the 2 + 6 format. There are 2x Kryo 465 performance cores (based on the Cortex-A76) clocked at 2.3GHz, and 6x Kryo 260 efficiency cores (based on the Cortex-A55) clocked at 1.8GHz. It also has Qualcomm’s Elite Gaming features such as HDR gaming, Qualcomm aptX Adaptive Audio, and smoother graphics. The Snapdragon 720G has the same Adreno 618 GPU present in the Snapdragon 730 with support for OpenGL ES 3.2 and Vulkan 1.1. It comes with a new Hexagon 692 DSP, and a new Spectra 350L image signal processor supports UFS 2.1 storage and maximum 8GB RAM. It has maximum display support of 2520 x 1080 at 90Hz or 120Hz with HDR10.
Snapdragon 662 (SM6115)
This new Chipset sits between the Snapdragon 660 and the Snapdragon 665, and the company said that “it is the first SoC in the Snapdragon 6-series to support storing images in the HEIF format which allows for higher quality photos at half the size.” The new SDM 662 SoC is an 11nm processor with 8x Kryo 260 (based on the Cortex-A73) cores clocked at 2GHz and in a 4 + 4 arrangement. It also has an Adreno 610 GPU, a Hexagon 683 AIE DSP, and a Spectra 340T image signal processor. It can support Full HD+ display resolution at 60Hz only, and UFS 2.1 storage. There is a Snapdragon X11 LTE modem with a download speed of up to 390Mbps and upload speed of up to 150Mbps. It also supports Wi-Fi 6, Bluetooth 5.1, and dual-frequency GPS.
Snapdragon 460 (SM4250-AA)
For affordable smartphones, Qualcomm has unveiled the Snapdragon 460 SoC that is touted to provide up to 70 percent and 60 percent performance increase over the existing Snapdragon 450 Chipset. According to Qualcomm, the Snapdragon 460 delivers twice the system performance of the Snapdragon 450. This new Chipset is built on the 11nm processor, and it has 8x Kryo 240 cores clocked at 1.8GHz and an Adreno 610 GPU with support for Vulkan 1.1. The SDM 460 Chipset supports a maximum display resolution of 2220 x 1080 at a 60Hz refresh rate and UFS 2.1 storage. It has a Hexagon 683 AIE DSP and a Spectra 340 ISP with support for HEIF photo capture. The Snapdragon 460 is the first 400-series Chipset to have Qualcomm’s FastConnect 6100, which provides maximum performance and better battery life. It supports WiFi-6, Bluetooth 5.1, and also has a Snapdragon X11 LTE modem with the same upload and download speeds as the Snapdragon 662.
Related: Qualcomm unveils Snapdragon 865 and 765 Chipsets with 5G connectivity.