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Qualcomm SD855 confirmed to be the next high-end SoC, details leaked ahead of launch

Published on Dec 4,2018 By Liam Hems Last Updated on 04-12-18 09:56:16

As we know Qualcomm has scheduled to launch its next high-end sm8155 codenamed chipset on December 4, today. But, all the highlighting features of the new coming Qualcomm SoC leaked ahead its official announcement. It has confirmed the Qualcomm Snapdragon 855 will be the next Qualcomm flagship SoC. The info comes from TechChrunch, it accidently revealed key features of the Qualcomm SD855. Soon after, TechChrunch has deleted the subjected article as it realized the mistake.

It is said that Qualcomm SD855 equipped with a 7nm processor and a dedicated NPU (Neural Processing Unit) to offer 3x better solutions and faster performance than the SD845. The SD855 is coupled with an Octa-core CPU having amazing three different clusters and clock rates; a single top-rated gold core of 2.84GHz frequency, three powerful cores of 2.42GHz frequency and four power-saving cores of 1.78GHz frequency. So, we can say the new Snapdragon SoC will add more performance and save more battery.

The upcoming high-end chipset will pack an Adreno 640 GPU for rich-graphics games and videos. For the gaming lovers, the Qualcomm SD855 is carrying a new feature called Snapdragon Elite Gaming. You will enjoy augmented reality with optimized graphics engine.

For Camera lovers, the SD855 is bringing a Computational Photography feature with the help of a specialized computational vision engine to let you enjoy more creativity in low light conditions.

5G is close to launch; therefore, the Snapdragon 855 is reported to be paired with X50 5G modem to support amazing fast fifth generation connectivity.

The trend of In-screen Fingerprint Sensor security is being promoted, so Qualcomm chip maker used to equip a 3D ultra sonic sensor in SD855 package to make it easier to use in-display FR even over protector without compromising security.

The 2019 flagship smartphones except iPhone are expected to be powered by Qualcomm Snapdragon 855. The Foldable Smartphones may also get this mobile platform. Royole has already used this SoC in its FlexPai handset while Samsung and Huawei are expected to be the next to make a use of this newer Qualcomm chipset for their top-tier devices.

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